ZYGO 4104C High power pulsed laser

The ZYGO 4104C high-power pulsed laser is a device that adopts advanced semiconductor pumping technology. It features high energy density, high stability and tunable pulse parameters, and is suitable for industrial fields such as material processing, cutting, drilling and welding.
Core Parameters
Laser Wavelength: 1064 nanometers (infrared band), suitable for processing a variety of metal and non-metal materials.
Peak Power: 2 kilowatts, providing high energy density to meet the requirements of precision processing.
Repetition Rate: Adjustable from 10 Hz to 200 Hz, allowing optimization of processing efficiency based on material characteristics.
Pulse Width: Adjustable from 10 nanoseconds to 50 nanoseconds, controlling the heat-affected zone and reducing material deformation.
Physical Specifications:
Dimensions: 100 mm × 100 mm × 100 mm, compact design for easy integration.
Weight: 2 kilograms, lightweight for mobile or automated equipment.
Operating Environment:
Temperature: 10°C to 35°C, suitable for conventional industrial environments.
Power Supply: 110 volts to 240 volts, 50 Hz to 60 Hz, globally compatible.

Technical Features
Semiconductor Pumping Technology:
Utilizing semiconductor pumping sources enhances electro-optical conversion efficiency and reduces energy consumption. Compared to traditional lamp-pumped lasers, it offers longer lifespan and higher stability.
Tunable Pulse Parameters:
Pulse width and repetition rate can be adjusted as needed to optimize processing results. For instance, short pulses (10 nanoseconds) are suitable for precise cutting, while long pulses (50 nanoseconds) are ideal for welding.
High Energy Density and Stability:
With a peak power of 2 kilowatts, it ensures sufficient single-pulse energy for processing thick materials. The output power fluctuation is minimal, guaranteeing consistent processing.

Application fields
Material processing:
Cutting: Suitable for precise cutting of metals (such as stainless steel, aluminum) and non-metals (such as ceramics, plastics).
Drilling: In the microelectronics and aerospace fields, it is used for high-precision drilling (such as circuit boards, turbine blades).
Welding: Achieves rapid welding of thin metal sheets with a small heat-affected zone and low deformation.
Industrial manufacturing:
Automobile manufacturing: Used for processing engine components and sensor housings.
Electronics industry: Micro-hole processing of circuit boards and chip packaging.
Medical devices: Precision welding and cutting of stainless steel instruments.

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