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LAM 678-087532-001 Semiconductor Constraint Ring

Brand/Manufacturer:LAM

Order Number: 678-087532-001

Country of Origin: USA

Condition: Original Brand

Lead Time: Available in stock

Payment Term: 100% TT In Advance

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 LAM Research 678-087532-001 Confinement Ring (Confinement Ring) Detailed Explanation

 1. Basic Positioning

This item is a original factory component of Lam Research semiconductor etching equipment**. It belongs to the category of **8-inch (200mm wafer) ceramic material confinement ring** and is used in the dry etching process chamber of the corresponding model. It belongs to the same category as the AMAT semiconductor chamber tooling parts you previously searched for, and it is a component of wafer manufacturing consumables.

 2. Core Specification Parameters Table

| Project | Details 
| Full Part Name | Confinement Ring (Constraint Ring / Enclosure Ring) |
| Wafers’ Compatibility Size | 8 inches (200mm) |
| Main Material | Special Engineering Ceramic (Silicon Oxide Modified Type) |
| Compatible Equipment | LAM’s 8-inch wafer dry etching machine chamber for process |
| Single Piece Weight | Approximately 0.2kg |
| Working Condition Tolerance | Capable of withstanding high temperatures during plasma etching and long-term erosion by corrosive process gases |

Core Functions

1. Plasma Constraint Control**: Constrains the plasma reaction area within the etching chamber, controls the gas flow field distribution, ensures uniform etching rate for the entire wafer, and avoids edge process deviations;
2. Cavity Protection Consumables**: Absorbs the deposition of plasma sputtering by-products, protects the side walls of the cavity, reduces the loss of the main cavity structure, and is a periodic PM maintenance consumable;
3. Airflow Guidance Optimization**: Regularizes the process inlet and outlet paths, stabilizes the vacuum pressure environment within the chamber, and improves the consistency of batch etching processes.

Application and Maintenance Key Points

 Typical Scenarios

For the dry etching process of the LAM 8-inch etching machine and the semiconductor wafer front-end processing line, it is combined with AMAT’s film deposition tooling components.




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