Product Description
Model: 0010-76260, Brand: Applied Materials (AMAT). Product Name: 8 HTHU Transfer Blade Assembly. It is a mechanical assembly for semiconductor wafer transfer. Designed for high-throughput wafer handling, this assembly is fabricated from low-particle, high-cleanliness material with high rigidity and low deformation. It reliably picks up and transfers wafers inside vacuum chambers, compatible with 8-station HTHU platform. It is a critical spare part for EFEM front-end module of semiconductor wafer processing tools, minimizing risks of wafer scratching and dropping during long-term operation.
Technical Parameters
- Product Name: 8 HTHU Wafer Transfer Blade Assembly
- Compatible Station: 8-station HTHU platform
- Wafer Size: 300mm silicon wafer
- Working Environment: Vacuum, cleanroom
- Material: High-purity low-outgassing ceramic / carbon fiber composite
- Cleanliness: Semiconductor Fab cleanroom specification
- Operating Temperature: Ambient, chamber temp ≤80℃
- Mechanical Property: High rigidity, low deflection, low particle generation
- Function: Wafer supporting, fast handling and positioning transfer
- Compatible Equipment: AMAT Centura wafer processing platform
- Part Type: Mechanical transfer assembly
Application
Used on Applied Materials semiconductor wafer fabrication equipment, installed in EFEM front-end wafer transfer module. It performs automatic wafer pick, handling and handover of 300mm wafers between atmospheric side and vacuum chambers, cooperating with wafer robot for wafer loading/unloading and inter-chamber transfer. Widely matched with PVD, CVD, etch and other thin-film deposition & etch process tools. It supports continuous automatic wafer transfer for high-volume production and acts as an essential consumable spare part for semiconductor manufacturing lines.
Same Series Models (AMAT Wafer Transfer Blade Assembly)
0010-76259, 0010-76260, 0010-76261, 0010-76262, 0010-76263, 0010-76264
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