TEB207-12 OGSI EC80-000157-12 TEL – Tokyo Electronics Semiconductor Equipment IO Main Control Board

TEB207-12 OGSI EC80-000157-12 TEL – Tokyo Electronics Semiconductor Equipment IO Main Control Board

I. Model Identification Explanation
TEB207-12: External Material Model
OGSI EC80-000157-12: Original Factory Part Code of TEL Equipment
Manufacturer: Tokyo Electron (TEL – Tokyo Electronics, the leading semiconductor equipment company in Japan)
Equipment to which it belongs: Etching machines, CVD/PVD film deposition machines, wafer cleaning machines, etc., semiconductor vacuum process equipment

Hardware Positioning and Core Functions
Integrated IO signal main control board, responsible for collecting and driving all on-site signals of the vacuum chamber, gas path, RF, temperature control, and mechanical hand, and connecting to the upper computer controller of the equipment.
Switching quantity channels
16 24VDC digital inputs DI: vacuum gauges, limit switches, valve feedback, safety doors, emergency stops, flow switches
16 24VDC transistor digital outputs DO: solenoid valves, vacuum valves, indicator lights, pneumatic actuators
Analog signal conditioning
Integrated multi-channel analog signal acquisition circuits, supporting 4–20mA pressure/flow sensors, thermocouple temperature measurement signal preprocessing
Multiple serial ports communication
Onboard RS232, RS485 interfaces, connecting flow meters, vacuum gauges, RF power supplies, and third-party auxiliary controllers
Backplane bus interface
Multiple sets of dedicated high-density connectors for high-speed data interaction with the equipment CPU motherboard, for issuing process control instructions, uploading equipment status and fault codes

Electrical and Environmental Parameters
Power supply: DC24V, overall equipment power supply
Operating temperature: -20℃ ~ +60℃, suitable for cleanroom cabinet
Protection: PCB bare board cabinet internal use, compatible with Class1000 cleanroom environment
Protection circuit: hardware self-lock protection for channel short circuit, overcurrent, and power supply reverse connection
Size: Approximately 160×120mm large board card, net weight 1.5kg
Certification: Semiconductor clean equipment industrial standard, CE

Board Interface Layout
Multiple sets of European-style terminal blocks: DI/DO on-site wiring terminals
DB9 serial ports: RS232 debugging, instrument communication
High-density gold finger sockets: equipment backplane system bus
Metal shielding signal module: analog signal isolation anti-interference unit
Status LED array: channel operation, communication, fault indicator lights

Application Scenarios
Only compatible with TEL semiconductor vacuum process equipment:
Plasma etching machine Etcher
CVD chemical vapor deposition, PVD physical vapor deposition coating equipment
Wafer wet cleaning, etch removal equipment
Film / diffusion furnace process auxiliary control subsystem