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TEL Tokyo 228-02-21-56-61 Semiconductor equipment main control driver board card

Brand/Manufacturer:TEL Tokyo 

Order Number: 228-02-21-56-61

Country of Origin: USA

Condition: Original Brand

Lead Time: Available in stock

Payment Term: 100% TT In Advance

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Product Overview

228-02-21-56-61 is an original Japanese main control drive board for TEL Tokyo Electron semiconductor process equipment, serving as the core mainboard of TEL etching, thin film deposition and plasma process systems. It undertakes overall equipment logic operation, process timing drive, multi-channel signal management and peripheral linkage control. It perfectly cooperates with supporting sub-boards including 2L81-050032-18, TAB113-1/101-LF and 228-02-21-56-61 to form a complete equipment control system.
Adopting high-end dedicated hardware for semiconductor processes, the board integrates customized industrial main control chips, isolated drive circuits and precision timing units with excellent stability and ultra-high timing accuracy. As an upgraded optimized version with AN suffix, it features improved circuit layout, anti-interference performance and anti-aging capability. It adapts to 7×24-hour uninterrupted precision production of wafer factories, acting as an essential original spare part for equipment fault replacement, daily maintenance and production line upgrading.

2. Technical Parameters

Parameter
Specification
Model Number
228-02-21-56-61
Brand & Origin
TEL Tokyo Electron, Original Japan Imported
Product Type
Semiconductor Equipment Main Control Drive Board / Timing Logic Control Board
Applicable Equipment
TEL wafer etching machines, PVD/CVD thin film deposition systems, plasma precision process equipment
Compatibility
Fully compatible with 2L81, TAB113, 228 series supporting sub-board assemblies
Core Functions
Overall logic operation, precise process timing drive, multi-signal management, peripheral linkage control, system data interaction
Hardware Technology
Multi-layer precision industrial PCB, fully isolated circuit, optimized EMC electromagnetic compatibility design
Version Feature
AN upgraded version with optimized anti-interference, low temperature drift and anti-aging performance
Operating Temperature
0℃ ~ +65℃ standard for semiconductor cleanroom
Operating Humidity
10%~90% non-condensing, cleanroom environment compatible
Process Standard
Lead-free eco-friendly process, compliant with high-end semiconductor cleanroom standards
Operational Characteristics
High timing accuracy, zero signal drift, stable long-term continuous operation, ultra-low failure rate
Origin
Made in Japan, original imported

3. Product Features

  • Full System Compatibility & Plug-and-Play
  • AN Upgraded Optimized Hardware Performance
  • Ultra-high Precision Timing Control
  • Full-isolation Anti-interference Industrial Design
  • High-cleanliness Eco-friendly Process
  • Long-term High-reliability Operation

4. Application Scope

The 228-02-21-56-61main control board is widely applied in semiconductor wafer etching processes, PVD/CVD thin film deposition processes, plasma precision processing equipment, high-end chip manufacturing automatic production lines, microelectronic precision process control equipment and full-series TEL semiconductor process equipment. As the core control center of the equipment, it undertakes overall logic operation, timing drive and signal management, ensuring the stability, repeatability and high yield rate of precision chip manufacturing processes. It is a key original component for wafer fab operation maintenance, equipment renovation and production line expansion.




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